conductive adhesive
Highest conductivity 👉 EG-4100 / EG-4101
Best heat dissipation 👉 EG-4410
Low viscosity, easy to handle 👉 EG-4900GBF
High-temperature applications (250°C) 👉 EG-4800 / EG-4840
High-strength adhesive 👉 EG-4100 / EG-4101
Heat dissipation insulation adhesive
Product Features
High thermal conductivity: The thermal conductivity can reach up to 11.4 W/m·K, effectively improving heat dissipation efficiency.
Matching different CTEs can reduce the stress caused by thermal expansion and contraction of materials and improve component life.
High temperature processing resistance: It can be reworked at high temperatures of 100°C, and the process flexibility is high.
Excellent electrical insulation: dielectric strength >29.5 kV/mm, volume resistivity >1×10¹⁴ ohm·cm.
Epoxy bonding system: flexible, reliable, solvent-free, suitable for bonding various packages and magnetic cores.
Typical applications
Semiconductor Packaging Thermally Conductive Bonding
Core structure fixing and assembly
High-power module bonding with heat dissipation element
CTE Structural bonding of different materials
Insulating adhesive
Product advantages
Flexible epoxy adhesives can effectively absorb stress and are suitable for brittle materials or environments with large thermal cycling changes.
Solvent-free formulations offer greater stability and lower volatility, improving process and product reliability.
High elasticity (high flexibility)
It can maintain structural integrity when the components are subjected to stress or temperature changes.
Typical applications
Ferrite Core Bonding
Suitable for assembling magnetic components such as transformers, inductors, and power modules, it can reduce the impact of thermal stress and improve adhesion reliability.
Insulating adhesive
High temperature resistant series
Chip bottom fill
Special high-temperature resistant fields
Fiber optic connector mating
High-temperature adhesives for semiconductor packaging
Fairfield offers a range of high-performance adhesive products designed specifically for semiconductor packaging processes. These products feature high temperature resistance, high reliability, and low stress, and are widely used in areas such as chip underfill, special high-temperature modules, and fiber optic splicing.
Features of high temperature resistant series products
High heat resistance: Tg up to 240°C, suitable for high-temperature assembly environments.
Excellent rheological properties: It has good spraying characteristics and self-shaping ability.
High insulation: Volume resistivity can reach 10¹³–10¹⁴ Ω·cm.
High reliability: low moisture absorption, low CTE, and high adhesive strength ensure long-term stability.
Main Products and Performance Highlights
EE-5500: Excellent flowability, self-shaping, and rapid curing; suitable for underfilling of wafers.
EG-5430: High Tg 240°C, with low moisture absorption and high heat resistance.
EM-7360F: 85D high hardness, 34 MPa strong adhesion, suitable for high temperature and high strength requirements.
EM-7361: High temperature resistance, high insulation and high dimensional stability, used in special high temperature modules.
Typical applications
Underfill
Improve solder joint reliability and enhance thermal shock resistance.High-temperature packaging is suitable for bonding and packaging power modules, high-frequency components, and high-temperature operating chips.
Fiber optic splicing provides stable mechanical strength and optical properties, making it suitable for optical communication module manufacturing processes.
Epoxy Series for Semiconductor Packaging and Encapsulation Applications
Product Features Highlights
High chemical stability: suitable for electronic modules that operate for extended periods.
High temperature resistance: It still has good adhesion properties at 160°C.
Excellent adhesion: It can maintain stable structural strength in high and low temperature environments.
High dielectric constant (some models): Suitable for special electrical applications.
High reliability: Suitable for packaging or structural components that require long-term stability.
Sensor potting
EG-9300 is a high-performance epoxy resin potting compound designed for high-reliability applications such as semiconductor packaging, sensor packaging, and chip protection. The product features high viscosity and excellent mechanical strength, providing long-term protection in harsh environments.
Advantages and highlights
Excellent environmental resistance: Suitable for high temperature, high humidity and chemical exposure environments.
Rapid curing: Shortens process time and improves production line efficiency
High adhesive strength: It can firmly protect electronic components and prevent damage from vibration and external forces.
Sensor potting
Typical applications
Sensor potting
Provides moisture-proof, dust-proof, and shock-proof protection for electronic components, improving product reliability and service life.
Chip Packaging
Suitable for demanding semiconductor packaging processes, protecting circuits from external environmental influences.
Inlet hole sealing
Advantages and features
Product advantages
High flow rate: suitable for large-volume, high-efficiency automated potting.
Rapid curing: Shortens process time and increases production capacity.
Low coefficient of thermal expansion: Reduces thermal stress and ensures long-term reliability.
Lead frame potting
It can effectively fill gaps, strengthen solder joints and conductive structures, and improve heat resistance and protection.
fast flow rate
Rapid curing
Low coefficient of thermal expansion
Epoxy Series for Semiconductor Packaging and Encapsulation Applications
Organosilicon series (insulators)
use:
Encapsulant for Semiconductor Wafer Packaging
Wafer Protection
Packaging gasket: Protects the chip from stress, vibration, or contamination.
Key features:
It has good elasticity, absorbs thermal stress, and prevents the chip from cracking due to thermal expansion.
High temperature resistant (150–250°C), reflow solderable
High insulation, dielectric strength >20 kV/mm
2. High-temperature resistant/high-refractive-index materials
EG-8003
Viscosity 4300 cp, hardness 70D
Features: High chemical stability, high refractive index, yellowing upon high-temperature baking, and good adhesion.
Applications: Suitable for optical component packaging or high-temperature operations.
EG-8004 / EG-8005
Viscosity 4500 cp, hardness 65D / 63D
Characteristics: High chemical stability, low refractive index, excellent optical transparency
Applications: Suitable for packaging optical components or wafers requiring high transparency (≥100 mm²).
1. High-adhesion wafer packaging
EG-8000
High viscosity (14000 cp), hardness 73D, Tg 48°C
Features: High chemical stability, high toughness, high adhesion
Applications: Suitable for large-size wafer (≥80 mm²) packaging.
EG-8001
Viscosity 7000 cp, hardness 63D, Tg 45°C
Features: High chemical stability, high toughness, high adhesion
Application: Suitable for medium-sized wafers (≥100 mm²) packages.
EG-8002
Viscosity 7000 cp, hardness 73D, Tg 50°C
Features: High chemical stability, high flexural strength, epoxy-based, high adhesion
Application: Suitable for bonding smaller chips.
3. Elastic or low-temperature applications
EG-8088
Extremely high viscosity (450,000 cp), hardness 35A, Tg -55°C
Features: Thixotropic, low stress, no primer required, high-temperature electrical insulation, high adhesion
Applications: Flexible electronics, low-temperature environments, and packaging requiring stress reduction.
EE-5690
Low viscosity (650–700 cp), density 0.99 g/cm³
Features: Low viscosity, low stress, rapid curing, low temperature resistance
Applications: Suitable for rapid coating or low-temperature operating environments, and microelectronic packaging.